该设备可稳定实现碳化硅晶片与石墨件之间的粘合及固化处理，可实现工件的原位除气、退火等工艺要求。设备按照国家、行业相关标准进行设计，其结构简单、设计合理、操作便捷、人机交互友好、温度和压力可以自动控制。
The equipment can stably realize the bonding and curing between silicon carbide wafers and graphite parts, and can realize the process requirements such as in-situ degassing and annealing of the workpiece. The equipment is designed according to the relevant national and industry standards, and its structure is simple, the design is reasonable, the operation is convenient, the human-machine interaction is friendly, the temperature and pressure can be automatically controlled.
本设备可广泛应用于碳化硅籽晶粘接、陶瓷烧结，金属扩散焊接等工艺技术，满足产品生产、技术研究、新材料合成的需求。
This equipment can be widely used in silicon carbide seed crystal bonding, ceramic sintering, metal diffusion welding and other technology, to meet the needs of product production, technical research, new material synthesis.
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